粘结材料对CTBGA封装组件热循环可靠性的影响Effects of adhesives on thermal cycle reliability of CTBGA assemblies
史洪宾,蔡琳,吴金昌
摘要(Abstract)：
对使用了8种粘结材料的12mmSAC305薄型球形栅格阵列(CTBGA)封装组件进行了热循环测试。结果显示,所有的粘结材料都降低了组件的热循环可靠性。具有较低线(热)膨胀系数,较高玻璃转化温度和储能模量的粘结材料可使组件热疲劳寿命相对更长,如使用了材料E(αll=48×10-6/℃;αl2=184×10-6/℃;θg=138℃;Es=3.660GPa)的组件比使用了同为边沿绑定材料D(αll=157×10-6/℃;αl2=198×10-6/℃;θg=78℃;Es=0.674GPa)的组件特征寿命增长了25.88%,首次失效时间延迟了57.71%。
关键词(KeyWords)： 粘结材料;薄型球形栅格阵列封装;热循环可靠性
基金项目(Foundation):
作者(Author): 史洪宾,蔡琳,吴金昌
DOI: 10.14106/j.cnki.1001-2028.2011.07.019
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