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铂薄膜电阻温度传感器因尺寸小、测温范围广、精度高而成为测温领域热点，但其长期稳定性与可靠性受封装材料所限制。现有的封装技术常因热膨胀系数(CTE)不匹配而引发热应力累积，导致微裂纹或孔洞，从而降低气密性并引入污染物，最终造成绝缘失效和性能漂移，尤其在高温热循环中更为明显。为应对此问题，提出在SiO2-CaO-B_2O3-Al_2O3基础玻璃体系中复合Al_2O3陶瓷粉体，以优化封装性能。实验表明，当Al_2O3添加量达到质量分数15%时孔隙率降低至0.86%,材料致密性得到显著提升，形成最优结构。密封材料在室温至800℃温区内，绝缘电阻率高达11×1012Ω·cm,展现卓越高温绝缘能力，经500次室温至800℃热循环后，孔隙率仅微增至1.29%,同时封装后的铂薄膜电阻温度系数(TCR)稳定维持在3780 ppm/℃,证明其优异的气密性和绝缘性。这一研究成功开发出兼具高密封性、高温绝缘性和热稳定性的玻璃陶瓷封装材料，为传感器封装长期技术难题提供了有效材料解决方案和理论支撑。
Abstract：Platinum thin-film resistance temperature sensors have garnered attention due to their compact size, broad temperature range, and superior accuracy. However, their long-term stability and reliability are limited by the packaging materials. The coefficient of thermal expansion(CTE) mismatch between glass and metal components often leads to the accumulation of thermal stress during thermal cycling. This leads to the formation of micro-cracks and pores, which reduce the hermeticity and allow contaminants to enter, ultimately causing insulation failure and performance drift, and this phenomenon is especially evident during high-temperature thermal cycling. To mitigate this issue, Al_2O3 ceramic powder was incorporated into a SiO2-CaO-B_2O3-Al_2O3 base glass system to enhance the packaging performance. Experimental results indicated that at an Al_2O3 content of 15%, porosity was reduced to 0.87%, and the material's density was significantly improved, resulting in an optimal structure. The sealing material demonstrated an electrical resistivity of 11×1012 Ω·cm from room temperature to 800 ℃, demonstrating excellent high-temperature insulation capabilities. After 500 thermal cycles between room temperature and 800 ℃, porosity only marginally increased to 1.3%, while the temperature coefficient of resistance(TCR) of the platinum thin film remained stable at 3780 ppm/℃ after packaging, attesting to its excellent gas tightness and insulation properties. This study successfully developed a glass ceramic packaging material characterized by high hermeticity, high-temperature insulation, and thermal stability, offering an effective material solution and theoretical support for the enduring technical challenges in sensor packaging.
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基本信息:
DOI：10.14106/j.cnki.1001-2028.2025.0287
中图分类号:TP212;TB42
引用信息:
[1]王耀成,王晓春,陈宜珩.氧化铝的添加量对铂薄膜传感器密封材料的影响[J].电子元件与材料,2025,44(12):1416-1425.DOI:10.14106/j.cnki.1001-2028.2025.0287.
基金信息:
国家自然科学基金(52202094); 常州市应用基础研究(CJ20241075)
2025-06-30
2025
2025-09-17
2025
1
2025-12-05
2025-12-05